New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

Addressing key challenges facing embedded-system designers — integrating of digital audio and improving power efficiency — the DPOxAUDIO and DPOxPWR modules are designed to automate key measurement ...

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

The last year has been great for Nvidia hardware. Nvidia released a graphics card using the Pascal architecture, 1080s are heating up server rooms the world over, and now Nvidia is making yet another ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has begun shipping low-current 3.3kV/400A and 3.3kV/200A versions of a Schottky barrier diode (SBD) ...

To add wireless connectivity to designs, product manufacturers need to get up to speed on wireless technologies as efficiently and inexpensively as possible. The most common way to add wireless ...

A locally designed module simplifies RFID integration for automation, tracking, and identification systems, reducing reliance ...