With the tech world in complete dissary, it's nice to report that new hardware in the GPU space is hitting delivery.
Chinese GPU developer Lisuan Technology has started shipping its 7G100 GPU, marking a significant step toward ...
AMD is simply performing at its very best right now, battling both Intel and NVIDIA at the same time in multiple markets -- CPUs and GPUs -- and doing a fan-freaking-tastic job at it. The company has ...
An unnamed Intel graphics card with a claimed thermal design power (TDP) of 300W has shown up on a shipping manifest, suggesting the company may be working on a new high-end version of its Arc ...
Nvidia announced today that its NVIDIA A100, the first of its GPUs based on its Ampere architecture, is now in full production and has begun shipping to customers globally. Ampere is a big ...
Intel has announced that its new DG1 GPU is now shipping, and that it's (hopefully exciting) gaming-focused Intel Xe-HPG DG2 is currently being tested in Intel's own labs. The new Intel DG1 -- or Iris ...
Nvidia's latest gaming GPU, the RTX 50-series, hasn't enjoyed a flawless launch. With high prices, low stock, and concerns over melting connectors, black screens, and unstable cards, it's transpired ...
Rumors of a bigger Battlemage GPU's demise may have been greatly exaggerated. Tech sleuth Haze spotted something interesting in the public shipping database over at NBD DATA: multiple entries for ...
OpenGL ES is an open, royalty-free, cross-platform 3D graphics API that is used in the majority of smartphones, tablets, and embedded systems. It is based on a subset of desktop OpenGL, enabling ...
In a nutshell: Intel has revealed its first gaming GPU in twenty years, the DG1 SDV (software development vehicle). Despite the wicked RGB-infused design, this model is for developers only, but it ...
Intel first announced its discrete GPU for small and medium businesses back at CES 2020 and now its desktop version is finally shipping. However, the GPU isn't available for regular consumers and ...
GC880 brings OpenGL ES 3.0 to silicon cost sensitive and power-constrained designs in a compact 3.5mm 2 final silicon footprint, including all recommended cache memories, using TSMC's 40nm LP process.