Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...
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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques
Imagine trying to build a tower out of hundreds of very thin, slightly different sheets of material, where each sheet wants to bend or warp on its own. That’s essentially what researchers at imec and ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
Part 1 of this series described how digital signals propagate through PC boards [Refs. 1, 2, 5, 6]. In part 2, we look at specific board designs to achieve low EMI. The biggest issue I see in my ...
Silicon bonding technology promises optimized density, power efficiency, and performance In conjunction with Raytheon Vision Systems, wafer-bonding-process developer Ziptronix (Morrisville, NC) has ...
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