KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

FCI extends its reflow process-compatible D-Sub family of connectors by introducing a new right-angle version for Pin-In-Paste (through-hole) technology. This product line extension will allow ...

Discrete electronic components such as resistors, capacitors and even larger IC's are shrinking down smaller every year, and that makes it harder for the average home maker or hobbyist to create their ...

The overall concept of reflow soldering is simple: put a pre-assembled board with some solder paste into an oven and bake it until the solder properly melts. When a board is reflowed, it typically is ...

One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

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