Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...

Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...

Ironwood Electronics has released a new spring pin test socket for DFN2 packages. The socket is engineered to support up to ...

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

BANGALORE, India, July 11, 2024 /PRNewswire/ -- Semiconductor Test Socket Market is Segmented by Type (Burn-in Socket, Test Socket), by Application (IC Design Company, Packaging Company, IDM, ...

Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...